IEC IEC 60749-22-1 Edition 1.0 2025-11 INTERNATIONAL STANDARD Semiconductordevices-Mechanicaland climatic testmethods - Part 22-1: Bond strength -wire bond pull test methods IEC 60749-22-1:2025-11(en) ICS 31.080.01 ISBN 978-2-8327-0861-3 THIS PUBLICATIONIS COPYRIGHT PROTECTED Copyright@2025IEC,Geneva,Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enguiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. IEC Secretariat Tel.: +41 22 919 02 11 3, rue de Varembe [email protected] CH-1211 Geneva 20 www.iec.ch Switzerland About the IEC International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC.Please make sure that you have the latest edition, a corrigendum or an amendment might have been published. IECpublications search- IECProducts &ServicesPortal-products.iec.ch webstore.iec.ch/advsearchform Discover our powerful search engine and read freely all the The advanced search enables to find IEC publications by a publications previews, graphical symbols and the glossary. variety of criteria (reference number, text, technical Witha subscription you wili always have access to up to date committee, ...).. It also gives. information on projects, content tailored to your needs. replaced and withdrawn publications. Electropedia-www.electropedia.org IECJustPublished-webstore.iec.ch/justpublished The world's leading online dictionary on electrotechnology. Stay up to date on all new IEC publications. Just Published containing more than 22 500 terminological entries in English details all new publications released. Available online and and French, with equivalentterms in 25 additional languages. once a month by email. Also known as the international Electrotechnical Vocabulary (IEV) online. IEC Customer Service Centre -webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre:[email protected]. Warning!Makesurethatyouobtainedthispublicationfromanauthorizeddistributor. IEC60749-22-1:2025IEC2025 CONTENTS FOREWORD. 5 1 Scope. 2 Normative references.. 3 Terms and definitions.. 8 4 Apparatus and material .. 11 4.1 Inspection equipment.. 11 4.2 Workholder.. 11 4.3 Wire bond pull equipment ... .11 4.4 Pulling hook. 11 4.5 Bond pull clamp.. 12 Procedure.. 5 12 5.1 Calibration .12 5.2 Visual examination of bonds to be tested after decapsulation . 12 5.2.1 Applicability.... 12 5.2.2 Bond pad examination and acceptability criteria for both aluminium and copperbondpadmetallization. 5.2.3 Examination and acceptability criteriafor Cuand Agwireand connections (all bonds).. 13 5.3 Performing the wire bond pull test ... 13 5.3.1 Wire bond pull test used .. .13 5.3.2 Hook pull method ... 13 5.3.3 Clamp pull method of single bond (cut wire). ..21 5.4 Examination of pulledwirebonds. ..23 5.5 Wire bond pull failure codes. .24 5.5.1 Tabulation of codes.. .24 5.5.2 .31 Definingcode6versusCode7forthermosonic stitchbonds 5.5.3 Discussion onthesignificance offailure codes. .32 5.6 Wire bond pull data... .33 5.6.1 Recording wire bond pull data. 5.6.2 Determining equivalent wire diameter for ribbon bonds . 5.6.3 Effective pull forceversus the actual force on a bond ... 6 Summary. ..34 AnnexA(informative)Guidanceforperformingpulltesting on stacked bonds (reverse, security and others).. A.1 Reverse bonds.. A.2 Security bonds .. A.3 Other stacked bonds. .37 Annex B (informative)Guidance for performing decapsulation on devices priorto bo