论文标题
在超导niobium上发现新化学抛光酸的铜催化剂
Discovery Of Copper Catalyst For New Chemical Polishing Acid On Superconducting Niobium
论文作者
论文摘要
高场Q斜坡（HFQ）严重限制了缓冲化学抛光（BCP）超导射频（SRF）niobium腔的高梯度性能。直接原因或机制尚未完全理解。在我们最近的广泛数据分析中，我们得出的结论是，潜在的根本原因可能是表面上的氮污染。在BCP期间，硝酸可以使用氢氟，硝酸和磷酸的混合物产生一硝基污染。基于这种思想，我们开始开发一种新的化学抛光酸，该化学抛光酸用过氧化氢代替硝酸。我们已经发现，这种新酸无法提供光滑的表面饰面，但是添加铜催化剂可以使该酸提供与常规BCP相似甚至更好的表面。本文首先显示了解决HFQ的重要性，然后总结了我们广泛的数据分析结果，并最终描述了我们发现铜催化剂的发现。
High field Q-slope (HFQS) seriously limits the high gradient performance of the buffered chemically polished (BCP) superconducting radio frequency (SRF) niobium cavities. The direct cause or mechanism is not yet fully understood. In our recent extensive data analysis, we concluded that the potential root cause could be nitrogen contamination on the surface. The nitric contamination could be created by nitric acid during BCP which uses the mixture of hydrofluoric acid, nitric acid, and phosphoric acid. Based on this thought, we started to develop a new chemical polishing acid that replaces the nitric acid by hydrogen peroxide. We have discovered that this new acid cannot provide smooth surface finishing, however adding copper catalyst allows this acid to provide a smooth surface similar to or even better than that from the conventional BCP. This paper first shows the significance of resolving HFQS, then summarizes our extensive data analysis results, and finally describes our discovery of the copper catalyst.
