论文标题
3D打印的Terahertz拓扑波导
3D-Printed Terahertz Topological Waveguides
论文作者
论文摘要
紧凑和健壮的波导芯片对于新的集成的Terahertz应用至关重要，例如处理器和宽带短距离无线通信之间的高速互连。拓扑光子晶体的进展显示出改善综合的Terahertz系统的潜力，这些系统遭受了尖锐弯曲周围的高损失。最近在相对较窄的带宽上报道了通过硅芯片上尖锐的弯曲弯曲的强大的Terahertz拓扑传输。在这里，我们报告了拓扑terahertz平面空气通道金属波导的实验证明，该波导可以集成到芯片互连中。我们的平台可以通过结合3D打印和镀金的简单，成本效益的技术来制造。测得的拓扑带隙的相对大小约为12.5％，这需要与全硅Terahertz拓扑波导（约7.8％）相比显着改善。我们进一步证明了围绕缺陷和延迟线的强大THZ传播。我们的工作为紧凑型综合Terahertz设备提供了有希望的道路，作为Terahertz无线通信的下一个领域。
Compact and robust waveguide chips are crucial for new integrated terahertz applications, such as high-speed interconnections between processors and broadband short-range wireless communications. Progress on topological photonic crystals shows potential to improve integrated terahertz systems that suffer from high losses around sharp bends. Robust terahertz topological transport through sharp bends on a silicon chip has been recently reported over a relatively narrow bandwidth. Here, we report the experimental demonstration of topological terahertz planar air-channel metallic waveguides which can be integrated into an on-chip interconnect. Our platform can be fabricated by a simple, cost-effective technique combining 3D-printing and gold-sputtering. The relative size of the measured topological bandgap is ~12.5%, which entails significant improvement over all-silicon terahertz topological waveguides (~7.8%). We further demonstrate robust THz propagation around defects and delay lines. Our work provides a promising path towards compact integrated terahertz devices as a next frontier for terahertz wireless communications.
