论文标题
具有上电导率和热导率的热膨胀的石墨聚醚酰亚胺复合材料
Thermally expanded graphite polyetherimide composite with superior electrical and thermal conductivity
论文作者
论文摘要
由于成本有效性，出色的电气和热能性能，热膨胀石墨（例如）聚合物复合材料在现代热电业中具有很高的潜力。在这项研究中，我们报告说，扩展的石墨聚醚酰亚胺（例如/PEID）复合材料已通过简单的溶液混合技术制造，将低成本EG填充物加固到宿主聚合物基质，聚醚酰亚胺（PEID）中。该技术使将3D石墨填充物纳入聚合物基质中，以保留扩展石墨的蠕虫结构，从而在整个复合材料中开发连续的网络。因此，在包含10wt％的EG填充剂时，聚合物电导率的电导率的增长约为969 s/m。使用有效培养基方法的理论预测揭示了不完全传导界面和界面隧穿对复合材料电导率的影响。我们还报告说，10wt％的填料组合物复合材料表现为7.3W/mk的热导率（K）值，这意味着与纯PEID相比，显着增强了3070％。扫描电子显微镜（SEM）表示填充物和复合材料的形态，揭示了EG的保留结构，以发展聚合物和填充物之间的导电途径。使用拉曼，X射线衍射（XRD）和X射线光电学光谱（XPS）分析，对EG填充物热膨胀之前和之后的结构特性进行了研究。总而言之，已经证明了简单的溶液混合途径，以实现出色的导电和导热性，例如，例如填充结构的效率，例如填充结构的效率。扩展的基于石墨的聚合物复合材料可以将其出色的特性保留在广泛的热和电子工业中。
Thermally expanded graphite (EG) polymer composite has high potential in modern thermoelectronic industry due to cost effectiveness, excellent electrical and thermal properties. In this study, we report that expanded graphite polyetherimide(EG/PEID) composite has been fabricated by simple solution mixing technique, reinforcing a low cost EG filler into host polymer matrix, polyetherimide (PEID). This technique enables the inclusion of 3D graphitic filler into polymer matrix retaining the worm structure of expanded graphite, thus developing continuous network throughout the composite. In result, ~19 orders of magnitude rise of the polymers electrical conductivity up to 969 S/m has been achieved upon the inclusion of the 10wt% of EG filler. Theoretical prediction using effective medium approach reveals the impact of an imperfectly conducting interface and interfacial tunneling on electrical conductivity of the composites. We also report that 10wt% EG filler composition composite exhibits the thermal conductivity (k) value of 7.3W/mK, implying significant enhancement of 3070% compared to pure PEID. Scanning Electron Microscopy (SEM) represents the morphology of fillers and composites, revealing the preserved structure of EG to develop the conductive pathway between polymer and filler. Investigation on the structural properties before and after the thermal expansion of EG fillers has been performed using Raman, X-ray diffraction (XRD) and X-ray Photoelectron Spectroscopy (XPS) analysis. In summary, a simple fabrication route of solution mixing has been demonstrated to achieve an outstanding electrically and thermally conductive EG/PEID composite without compromising the efficiency of EG filler structure. The expanded graphite-based polymer composites can retain their outstanding properties in wide range of thermal and electronic industry.
