论文标题
使用单步电子光刻过程实现的超导量子设备的铝制空气桥
Aluminum air bridges for superconducting quantum devices realized using a single step electron-beam lithography process
论文作者
论文摘要
在超导量子设备中，空气桥可提高电路的复杂性和密度，并减轻模式混合而产生的微波损失的风险。我们使用基于单步电子梁梯度暴露的简单过程实施铝制空气桥。由此产生的桥梁的尺寸从$ 20〜μm $到$ 100〜μm $不等，收益率超过$ 99〜 \％$，长度最高为$ 36〜μm $。当用来连接共面波导谐振器中的接地平面时，导致系统的诱导损耗可以忽略不计，对应于降低质量因子超过$ 1.0 \ times 10^8 $的质量因子。桥梁过程与约瑟夫森连接兼容，并允许在超导层之间同时创建低损失绷带。
In superconducting quantum devices, air bridges enable increased circuit complexity and density as well as mitigate the risk of microwave loss arising from mode mixing. We implement aluminum air bridges using a simple process based on single-step electron-beam gradient exposure. The resulting bridges have sizes ranging from $20~μm$ to $100~μm$, with a yield exceeding $99~\%$ for lengths up to $36~μm$. When used to connect ground planes in coplanar waveguide resonators, the induced loss contributed to the system is negligible, corresponding to a reduction of the quality factor exceeding $1.0\times10^8$ per bridge. The bridge process is compatible with Josephson junctions and allows for the simultaneous creation of low loss bandages between superconducting layers.
