论文标题
单晶硅热电话通过声子工程
Single-Crystal Silicon Thermoelectrics by Phonon Engineering
论文作者
论文摘要
在此,我们报告了将纳米结构的晶体SI用作热电材料及其整合到热电收割机中的使用。概念验证依赖于对晶格热传输的部分抑制,这是通过引入电子平均自由路径和声子平均自由路径之间尺寸缩放的孔。换句话说,我们人为地针对针对热电效率的电子晶体声子玻璃折衷。使用CMOS兼容工艺制造设备,并在温度差异(从几个k到200 k的温度差异下,在整个热op的温度差异下,都会从每cm^2的几微米到几毫瓦。这些数字证明了使用硅芯片使用cm^2以下的硅芯片使用环境或身体热的自动驾驶设备的能力。本文还报告了将开发的示威者用于集成热电冷却的可能性。
Herein, we report the use of nanostructured crystalline Si as a thermoelectric material and its integration into thermoelectric harvesters. The proof-of-concept relies on the partial suppression of lattice thermal transport by introducing pores with dimensions scaling between the electron mean free path and the phonon mean free path. In other words, we artificially aimed at the electron crystal phonon glass tradeoff targeted for thermoelectric efficiency. The devices were fabricated using CMOS compatible processes and exhibited power generation from a few microWatts per cm^2 to a few milliWatts per cm^2 under temperature differences from a few K to 200 K across the thermopiles. These numbers demonstrate the capability to power autonomous devices with environmental or body heat using silicon chips with areas below cm^2. This paper also reports the possibility of using the developed demonstrators for integrated thermoelectric cooling.