论文标题
硅中有图案的三角层设备的非破坏性X射线成像
Non-destructive X-ray imaging of patterned delta-layer devices in silicon
论文作者
论文摘要
集成电子设备中微型化的进展导致硅中的原子和纳米大小的掺杂器设备。可以使用磷和砷等各种掺杂剂来常规制造这种结构,以抗氢的光刻制作。但是,最终结构的非破坏性特异性图像的非破坏性特异性图像的能力(这将是构建更复杂的纳米级设备(例如量子协会)的必不可少的工具,仍然是尚未解决的挑战。在这里,我们利用X射线荧光以在硅中创建特定于掺杂剂的元素特异性图像,绝对单位的掺杂剂密度和受梁焦距限制的分辨率(此处为$ \ sim1〜μ $ m),而不会影响设备的低温电子性能。将X射线数据提供的AS密度与从HALL效应测量结果以及标准的不可重复的,扫描隧道显微镜和次级离子质谱,技术进行比较。在X射线实验之前和之后,我们还测量了磁性传统,以弱定位为主,量子干扰效应对样品尺寸和无序极为敏感。 Notwithstanding the $1.5\times10^{10}$ Sv ($1.5\times10^{16}$ Rad/cm$^{-2}$) exposure of the device to X-rays, all transport data were unchanged to within experimental errors, corresponding to upper bounds of 0.2 Angstroms for the radiation-induced motion of the typical As atom and 3$\%$ for the loss of activated,载体分支掺杂剂。使用下一代同步子辐射源和更高级的光学元件,我们预见到可以在5 nm的分辨半径内获得单个掺杂原子的X射线图像。
The progress of miniaturisation in integrated electronics has led to atomic and nanometre-sized dopant devices in silicon. Such structures can be fabricated routinely by hydrogen resist lithography, using various dopants such as phosphorous and arsenic. However, the ability to non-destructively obtain atomic-species-specific images of the final structure, which would be an indispensable tool for building more complex nano-scale devices, such as quantum co-processors, remains an unresolved challenge. Here we exploit X-ray fluorescence to create an element-specific image of As dopants in silicon, with dopant densities in absolute units and a resolution limited by the beam focal size (here $\sim1~μ$m), without affecting the device's low temperature electronic properties. The As densities provided by the X-ray data are compared to those derived from Hall effect measurements as well as the standard non-repeatable, scanning tunnelling microscopy and secondary ion mass spectroscopy, techniques. Before and after the X-ray experiments, we also measured the magneto-conductance, dominated by weak localisation, a quantum interference effect extremely sensitive to sample dimensions and disorder. Notwithstanding the $1.5\times10^{10}$ Sv ($1.5\times10^{16}$ Rad/cm$^{-2}$) exposure of the device to X-rays, all transport data were unchanged to within experimental errors, corresponding to upper bounds of 0.2 Angstroms for the radiation-induced motion of the typical As atom and 3$\%$ for the loss of activated, carrier-contributing dopants. With next generation synchrotron radiation sources and more advanced optics, we foresee that it will be possible to obtain X-ray images of single dopant atoms within resolved radii of 5 nm.