论文标题
如何为您的应用选择最佳的CMO技术
How to Choose the Best CMOS Technology for Your Application
论文作者
论文摘要
补充金属氧化物 - 氧化型 - 氧化物 - 氧化物（CMOS）是整合电路制造的最广泛传播的技术。每个铸造厂都提供不同的技术节点，其特征是最小特征大小，这是最小的尺寸，可以使用具有所需精度的照片模拟制造。最小特征尺寸的范围从350nm到5nm。每个设计师都必须选择实施其设计的最佳技术，设计师必须指定铸造厂，技术节点以及任何其他功能，例如金属层的数量和MIM电容器密度。在此白皮书中，我们将在选择用于电源管理的最佳技术节点时描述各种权衡。您将学习1）半导体产品业务模型2）制造技术特征3）如何根据应用程序选择用于制造的最佳技术节点，4）如何随着设计的销售而硅芯片缩放的成本。
Complementary-metal-oxide-semiconductor (CMOS) is the most widely spread technology for integrated circuits fabrication. Each foundry offers different technology nodes that are characterized by the minimum feature size, which is the smallest dimension that can be fabricated using photo-lithography with the required precision. The minimum feature size ranges from 350nm to 5nm. Each designer has to select the best technology for implementing their designs, and the designer has to specify the foundry, the technology node, and any additional features like the number of metal layers, and MIM capacitor density. In this white paper, we will describe the various trade-offs while selecting the optimal technology node for power management. You will learn 1) Semiconductor products business models 2) fabrication technologies features 3) how to select the optimal technology node for fabrication according to the application, 4) how the cost of a silicon chip scales with the sales of your design.
