T/GITIF011—2023 WiFi&蓝牙一体化透传片技术规范 TechnicalspecificationofWiFi&Bluetoothintegratedpass-throughchipICS01.040.31 CCSL56 团体标准 2023－2－21发布 2023－2－22实施 广东省电子信息联合会发布 全国团体标准信息平台 全国团体标准信息平台 T/GITIF011-2023 I目录 前言..............................................................................III 引言...............................................................................IV 1范围................................................................................1 2规范性引用文件......................................................................1 3术语及定义..........................................................................1 3.1移动热点（WiFi）....................................................................1 3.2经典蓝牙（BT）......................................................................1 3.3低功耗蓝牙（BLE）...................................................................1 3.4射频（RF）.........................................................................1 3.5发射端（TX）.......................................................................2 3.6接收端（RX）.......................................................................2 3.7无线接入点（AP）...................................................................2 3.8站点（STA）.........................................................................2 3.9带外阻塞（Out-of-bandblocking）.....................................................2 3.10带内杂散发射（In-bandSpuriousEmission）............................................2 3.11临道抑制（ReceiveAdjacentChannelRejection）........................................2 4缩写语..............................................................................2 4.1FER（FrameErrorRate）............................................................2 4.2OFDM（OrthogonalFrequencyDivisionMultiplexing）................................2 4.3BPSK（BinaryPhaseShiftKeying）.................................................3 4.4QPSK（QuadraturePhaseShiftKeying）..............................................3 4.5UART（UniversalAsynchronousReceiver/Transmitter）................................3 4.6SDIO（SecureDigitalInputandOutput）...........................................3 4.7EVM（ErrorVectorMagnitude）......................................................3 4.8DUT（DeviceUnderTest）.........................................................3 5技术要求............................................................................3 5.1总则...............................................................................3 5.2RF传导性能.........................................................................4 5.3功耗................................................................................6 6测试方法.............................................................................6 6.1RF传导特性测试.....................................................................7 6.1.1测试环境条件.....................................................................7 6.1.2测试场地.........................................................................7 6.1.3测试装置.........................................................................7 6.1.4测试步骤.........................................................................7 6.2功耗测试............................................................................8 6.2.1测试环境条件.....................................................................8 6.2.2测试场地.........................................................................8 6.2.3测试装置.........................................................................8 全国团体标准信息平台 T/GITIF011-2023 II6.2.4测试步骤.........................................................................8 7标志、包装、运输、贮存...............................................................9 7.1标志................................................................................9 7.2包装................................................................................9 7.3运输................................................................................9 7.4贮存................................................................................9 附录A..........