ICS 31.180 CCS L 30 T/CPCA 6042A–2023 代替T/CPCA 6042–2016 银浆贯孔印制电路板 Silver pasted t hrough -hole printed circuit board 2023-05-05 发布 2023-06-05 实施中国电子电路 团体标准 中国电子电路行业协会 发布 全国团体标准信息平台 全国团体标准信息平台 CPCA 6042A -2023 I 目 次 前言 ................................ ................................ ................. I 1 范围 ................................ ................................ ............... 1 2 规范性引用文件 ................................ ................................ ..... 1 3 术语和定义 ................................ ................................ ......... 1 4 要求 ................................ ................................ ............... 2 4.1 总则 ................................ ................................ ........... 2 4.2 应用等级 ................................ ................................ ....... 2 4.3 优先顺序 ................................ ................................ ....... 2 4.4 材料 ................................ ................................ ........... 2 4.4.1 基材 ................................ ................................ ........ 2 4.4.2 银浆 ................................ ................................ ........ 2 4.4.3 阻焊剂 ................................ ................................ ...... 2 4.4.4 字符印料 ...................................................................... 2 4.4.5 限用物质 ......................................................................3 4.5 外观要求 ................................ ................................ ....... 3 4.5.1 银浆贯孔外观 ................................ ................................ 3 4.5.2 银浆贯孔盘保护层外观 ................................ ........................ 4 4.5.3 铜箔导线、连接盘外观 ................................ ........................ 4 4.5.4 阻焊层外观 ................................ ................................ .. 5 4.5.5 碳膜外观 ................................ ................................ .... 6 4.5.6 文字标记外观 ................................ ................................ 6 4.5.7 可剥胶的外观 ................................ ................................ 6 4.5.8 银触点涂层的外观 ................................ ............................ 6 4.5.9 元件插件孔的外观 ................................ ............................ 6 4.5.10 银浆贯孔内部截面表征 ................................ ....................... 6 4.6 尺寸要求 ................................ ................................ ....... 7 4.6.1 外形尺寸 ................................ ................................ .... 7 4.6.2 V 槽尺寸 ................................ ................................ ..... 7 4.6.3 孔的尺寸 ................................ ................................ .... 7 4.6.4 铜箔图形尺寸 ................................ ................................ 8 4.6.5 碳膜图形尺寸 ................................ ................................ 8 4.6.6 银触点涂层厚度 ................................ .............................. 8 4.6.7 要素相对位置 ................................ ................................ 8 4.6.8 插件孔连接盘铜箔环宽尺寸 ................................ .................... 9 4.6.9 银浆贯孔印制电路板 厚度尺寸 ................................ .................. 9 4.6.10 银浆贯孔印制电路板 弓曲和扭曲 ................................ ............... 10 4.6.11 贯孔银浆厚度 ................................ ............................... 10 4.6.12 阻焊膜厚度 ................................ ................................ . 10 4.6.13 银浆保护层厚度 ................................ ............................. 10 4.6.14 碳膜厚度 ................................ ................................ ... 10 4.7 电气性能 ................................ ................................ ..... 11 全国团体标准信息平台 CPCA 6042A -2023 II 4.7.1 银浆贯孔孔电阻 ................................ ............................. 11 4.7.2 银浆贯孔印制电路板 碳膜方阻 ................................ ................. 11 4.7.3 表面绝缘电阻 ................................ ............