IEC 63378-2-1:2024 Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

IEC 63378-2-1:2024 Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages 简介

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

IEC 63378-2-1:2024 Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages 基本信息

标准号 : IEC 63378-2-1:2024

版本 : 1.0

标准来源 : IEC

标准发布组织 : IEC

标准页数 : 15

国际组织机构 : TC 47/SC 47D

标准语言 : EN

发布日期 : 2024-10-22

IEC 63378-2-1:2024 Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages 相关标准